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SN74LVC1G38DCKR IC Chip Integrated Circuit Single 5.5V NAND Gate Open Drain Outputs

Shenzhen Sai Collie Technology Co., Ltd.
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    Buy cheap SN74LVC1G38DCKR IC Chip Integrated Circuit Single 5.5V NAND Gate Open Drain Outputs from wholesalers
     
    Buy cheap SN74LVC1G38DCKR IC Chip Integrated Circuit Single 5.5V NAND Gate Open Drain Outputs from wholesalers
    • Buy cheap SN74LVC1G38DCKR IC Chip Integrated Circuit Single 5.5V NAND Gate Open Drain Outputs from wholesalers

    SN74LVC1G38DCKR IC Chip Integrated Circuit Single 5.5V NAND Gate Open Drain Outputs

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    Brand Name : TI
    Model Number : SN74LVC1G38DCKR
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 999999
    Delivery Time : 1 - 3 days
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    SN74LVC1G38DCKR IC Chip Integrated Circuit Single 5.5V NAND Gate Open Drain Outputs

    SN74LVC1G38DCKR Integrated Circuit IC

    Chip Single 2 Input 1.65V To 5.5V NAND Gate Open Drain Outputs Package SC-70-5


    Logic Type
    Number of Circuits
    1
    Number of Inputs
    2
    Features
    Open Drain
    Voltage - Supply
    1.65V ~ 5.5V
    Current - Quiescent (Max)
    10 µA
    Current - Output High, Low
    -, 32mA
    Input Logic Level - Low
    0.7V ~ 0.8V
    Input Logic Level - High
    1.7V ~ 2V
    Max Propagation Delay @ V, Max CL
    3.9ns @ 5V, 50pF
    Operating Temperature
    -40°C ~ 125°C
    Mounting Type
    Supplier Device Package
    Package / Case
    5-TSSOP, SC-70-5, SOT-353
    Base Product Number

    SN74LVC1G38DCKR Description


    The SN74LVC1G38DCKR device is designed for 1.65-V to 5.5-V VCC operation.


    This device is a single two-input NAND buffer gate with open-drain output. It performs the Boolean function Y = A × B or Y = A + B in positive logic.


    This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.


    NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.


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