General Description
A. The value of RθJA is measured with the device mounted on 1in2
FR-4 board with 2oz. Copper, in a still air environment with TA
=25°C. The Power dissipation PDSM is based on R θJA t≤ 10s and the
maximum allowed junction temperature of 150°C. The value in any
given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using
junction-to-case thermal resistance, and is more useful in setting
the upper
dissipation limit for cases where additional heatsinking is used.
C. Single pulse width limited by junction temperature
TJ(MAX)=150°C.
D. The RθJA is the sum of the thermal impedance from junction to
case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using
<300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance
which is measured with the device mounted to a large heatsink,
assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA
curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2 FR-4
board with 2oz. Copper, in a still air environment with TA=25°C.
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