10M16DCF256I7G Programmable IC Chip
Field Programmable Gate Array (FPGA) IC 178 562176 16000 Package 256-LBGA

Number of LABs/CLBs	1000
Number of Logic Elements/Cells	16000
Total RAM Bits	562176
Number of I/O	178
Voltage - Supply	1.15V ~ 1.25V
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	256-LBGA
Supplier Device Package	256-FBGA (17x17)

DC Characteristics
Supply Current and Power Consumption
Intel offers two ways to estimate power for your design-the Excel-based Early Power Estimator (EPE) and the Intel QuartusPrime Power Analyzer feature.
Use the Excel-based EPE before you start your design to estimate the supply current for your design. The EPE provides amagnitude estimate of the device power because these currents vary greatly with the usage of the resources.
The Intel Ouartus Prime Power Analyzer provides better quality estimates based on the specifics of the design after youcomplete place-and-route. The Power Analyzer can apply a combination of user-entered, simulation-derived, and estimatedsignal activities that, when combined with detaled circuit models, vield very accurate power estimates, Intel Quartus Prime Standard Edition User Guide: Power Analysis and OptimizationProvides more information about power estimation tools.
I/o Pin Leakage Current
The values in the table are specified for normal device operation. The values vary during device power-up. This applies for alVccio settings (3.3,3.0, 2.5,1.8,1.5,1.35, and 1.2 V).
10 pA I/0 leakage current limit is applicable when the internal clamping diode is off. A higher current can be the observedwhen the diode is on.
Input channel leakage of ADC I/0 pins due to hot socket is up to maximum of 1.8 mA. The input channel leakage occurs whenthe ADC IP core is enabled or disabled, This is applicable to al Intel MAX 10 devices with ADC IP core, which are 10M04,10M08.10M16.10M25.10M40 and 10M50 devices, The ADC I/0 pins are in Bank 1A.

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