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XC6SLX45-2FGG676C Xilinx FPGA Field Programming IC Chip Gate Array 45K Gates

    Buy cheap XC6SLX45-2FGG676C Xilinx FPGA Field Programming IC Chip Gate Array 45K Gates from wholesalers
     
    Buy cheap XC6SLX45-2FGG676C Xilinx FPGA Field Programming IC Chip Gate Array 45K Gates from wholesalers
    • Buy cheap XC6SLX45-2FGG676C Xilinx FPGA Field Programming IC Chip Gate Array 45K Gates from wholesalers

    XC6SLX45-2FGG676C Xilinx FPGA Field Programming IC Chip Gate Array 45K Gates

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    Brand Name : XILINX / AMD
    Model Number : XC6SLX45-2FGG676C
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 999999
    Delivery Time : 1-3 days
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    XC6SLX45-2FGG676C Xilinx FPGA Field Programming IC Chip Gate Array 45K Gates

    XC6SLX45-2FGG676C Xilinx FPGA Field Programmable Gate Array Spartan-6 Series 45K Gates 676-FBGA Package


    Number of LABs/CLBs
    3411
    Number of Logic Elements/Cells
    43661
    Total RAM Bits
    2138112
    Number of I/O
    358
    Voltage - Supply
    1.14V ~ 1.26V
    Mounting Type
    Operating Temperature
    0°C ~ 85°C (TJ)
    Package / Case
    Supplier Device Package
    676-FBGA (27x27)

    Product Listing: Programmable IC Chip - XC6SLX45-2FGG676C

    Product Name: Programmable IC Chip - XC6SLX45-2FGG676C

    Product Description: The Programmable IC Chip - XC6SLX45-2FGG676C is a high-performance integrated circuit designed for programmable logic applications. It offers advanced features and capabilities, making it suitable for a wide range of electronic projects and designs that require flexibility and powerful processing capabilities.

    Product Specifications:

    • Model: XC6SLX45-2FGG676C
    • Package Type: 676-pin Fine-pitch Ball Grid Array (FGG676)
    • Manufacturer: Xilinx
    • Operating Temperature: -40°C to 100°C
    • Logic Cells: 43,661
    • Maximum User I/O Pins: 500
    • Block RAM: 2,592 Kbits
    • DSP Slices: 48
    • Clock Management Tiles: 6
    • JTAG Boundary Scan Support: Yes
    • Configuration Memory: Non-volatile Flash
    • Power Supply Voltage: 1.2V core voltage, 3.3V I/O voltage

    Key Features:

    • High-performance programmable logic device with advanced capabilities
    • Fine-pitch Ball Grid Array (FGG676) package for efficient integration
    • Large number of logic cells for complex designs and computations
    • Abundant I/O pins for versatile connectivity options
    • Ample block RAM for data storage and processing requirements
    • Dedicated DSP slices for high-speed signal processing tasks
    • Multiple clock management tiles for precise timing control
    • JTAG boundary scan support for easy debugging and testing
    • Non-volatile flash memory for secure and reliable configuration storage
    • Wide operating temperature range for diverse environments
    • Low power consumption for energy-efficient designs

    Applications:

    • Data processing and computing systems
    • Communication and networking infrastructure
    • High-speed data acquisition and control systems
    • Video and image processing applications
    • Aerospace and defense systems
    • Industrial automation and control systems
    • Medical imaging and diagnostics equipment
    • Research and development projects
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